Patterned wafer inspection using spatial filtering
US6686602B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 15, 2002 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Jan 22, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/95623
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Apparatus for spatial filtering includes a Fourier lens, adapted to collect radiation emitted from a point and to separate the collected radiation into spatial components in a Fourier plane of the lens, and a programmable spatial filter, positioned at the Fourier plane. An image sensor is optically coupled to capture an image of the spatial components of the collected radiation in the Fourier plane, while the components are incident on the filter. A filter controller is coupled to receive and analyze the image captured by the image sensor and, responsive thereto, to control the spatial filter so as to block one or more of the spatial components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.