Multi-chip semiconductor package with integral shield and antenna
US6686649B1 · kind B1 · utility
225Cited by
5References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 14, 2001 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Jul 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.