Vacuum processing system having improved substrate heating and cooling
US6688375B1 · kind B1 · utility
205Cited by
34References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1997 |
| Grant date | Feb 10, 2004 |
| Priority date | — |
| Expiry date | Oct 14, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/54
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention is directed a vacuum processing system having improved substrate heating and cooling facilities. An evacuable chamber of the system includes a first section in which a temperature of a substrate to be processed may be increased and a second section in which the temperature of a processed substrate may be decreased. A barrier may be provided to thermally isolate the first and second sections from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.