Solder paste for fabricating bump
US6692581B2 · kind B2 · utility
16Cited by
10References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2003 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Feb 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/043
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder paste for fabricating bumps includes a flux and metallic alloy powder. The metallic alloy powder includes a plurality of low eutectic metallic alloy granules, and the size of these metallic alloy granules is 20-60 &mgr;m and the average size of the metallic granules is 35 &mgr;m to 45 &mgr;m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.