Patent · US Expired

Method for fabricating an optical transmitting subassembly

US6693312B2 · kind B2 · utility

2Cited by

4References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ralf Dietrich · Munich, DE
Mathias Kämpf · Burglengenfeld, DE
Wolfgang Gramann · Regensburg, DE
Martin Weigert · Lindlar, DE

Key dates

Filing date	Jul 22, 2002
Grant date	Feb 17, 2004
Priority date	—
Expiry date	Jul 22, 2022

Classification

Technology area (CPC G)Physics
CPC primaryG02B6/423
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A photo-optical transmitter assembly is produced in the following manner: a glass wafer is fixed onto a transparent submount and a V-shaped recess is subsequently created between optical prism elements using targeted sawcuts. A rod-shaped element with a reflective coating is inserted into the V-shaped recess. A laser beam from a semiconductor laser is thus deflected by 90° on the rod-shaped element with the reflective coating and traverses the submount.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.