Method and apparatus for substrate surface inspection using spectral profiling techniques
US6693708B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 6, 2000 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Mar 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. In one aspect, a light source is used in conjunction with an optical receiving device, such as a spectrometer, to illuminate and inspect a substrate for various optical signatures. In one embodiment, spectral data collected from a given substrate is used to generate a spectral signature. The spectral signature represents the intensity distribution of the color sonstituents of a substrate surface. This color signature may then be compared to a reference color signature to determine characteristics such as the substrate type, thickness, conformity, substrate surface uniformity, and residual materials in processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.