Electronic device processing equipment having contact gasket between chamber parts
US6695318B2 · kind B2 · utility
1Cited by
9References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2001 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Aug 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32477
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An arrangement for improved thermal and/or electrical coupling between parts disposed in electronic device processing equipment is provided. In an illustrated embodiment, an improved coupling between a chamber liner and a chamber wall is provided which can be utilized in semiconductor processing equipment. The arrangement includes a compressible coupling or gasket which is compressed between a wedge ring and the chamber wall. The chamber liner is coupled to the wedge ring, so that the chamber liner is coupled to the chamber wall by way of the wedge ring and compressible coupling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.