Endpoint detection system for wafer polishing
US6695681B2 · kind B2 · utility
4Cited by
10References
34Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 25, 2002 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Nov 25, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.