Mold for flashless injection molding to encapsulate an integrated circuit chip
US6696006B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2001 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | May 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection mold is provided for injection molding an encapsulation material to encapsulate at least one integrated circuit chip. The injection mold includes at least two parts that define at least one injection circuit, and at least one blind complementary channel communicating with the injection circuit. The injection circuit includes at least one injection cavity for housing the chip, at least one transfer chamber from which the encapsulation material is injected, and at least one injection channel connecting the transfer chamber to the injection cavity. The blind complementary channel is formed between the two parts of the mold and forms at least one appendage of encapsulation material that is connected to the encapsulation material that fills the injection circuit. Also provided is a method for injection molding an encapsulation material to encapsulate at least one integrated circuit chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.