Jonathan Abela
6Patents
3h-index
2Co-inventors
43Inventor score
Filing activity: May 22, 2001 → Jun 15, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7495325B2 | Optical die-down quad flat non-leaded package | Electricity | 6 | Expired |
| US7736930B2 | Optical die-down quad flat non-leaded package | Electricity | 5 | Active |
| US6858933B2 | Injection mold for an optical semiconductor package and corresponding optical semiconductor package | Electricity | 5 | Expired |
| US6696006B2 | Mold for flashless injection molding to encapsulate an integrated circuit chip | Electricity | 1 | Expired |
| US7994645B2 | Integrated circuit package system with wire-in-film isolation barrier | Electricity | 0 | Active |
| US8415810B2 | Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.