Method of manufacturing a semiconductor integrated circuit device having a memory cell array and a peripheral circuit region
US6696337B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 11, 2002 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Aug 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76816
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In semiconductor integrated circuit device having a DRAM including a memory cell portion formed at a first portion of a main surface of a semiconductor substrate and a peripheral circuit portion formed at a second portion of the main surface of the semiconductor substrate, bit line conductors and first level interconnect conductors in the peripheral circuit portion for connecting the memory cell portion and the peripheral circuit portion so as to exchange signals between them are constituted by conductor layers that are formed simultaneously and hence, exist at the same level. The conductor layers exist at an outside position of the memory cell portion such as in the peripheral circuit portion, and the thickness of portions of the conductor layers constituting the first level interconnect conductors of the peripheral circuit portion is greater than the thickness of portions of the conductor layers constituting the bit line conductors. A position at which a transistor for selectively connecting the memory cell portion and the peripheral circuit portion is formed may be a boundary, or a position inside a boundary region between the memory cell portion and the peripheral circuit porti…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.