Method of and apparatus for substrate pre-treatment
US6696363B2 · kind B2 · utility
15Cited by
15References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2001 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Oct 31, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to a method and apparatus for converting a precursor material, preferably organometallic, to a film, preferably metal-containing, that is adherent to at least a portion of a substrate. Both method and apparatus include a pre-conversion step or section, and a step or section for substantial conversion of a portion of material from the pre-conversion step or section into the form of a predetermined pattern, wherein this substantial conversion results in a metal-containing patterned layer on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.