System for the improved handling of wafers within a process tool
US6696367B1 · kind B1 · utility
408Cited by
16References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2002 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Sep 27, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate fabrication system is provided which includes a buffer station located inline between a front docking port and a loadlock chamber, the buffer station being operatively joined with a front handling chamber. Preferred embodiments employ a buffer station having a rack with reduced pitch, or relative spacing between shelves. Additional embodiments provide variable pitch end effectors as part of the disclosed fabrication system. Methods of fabricating wafers by quickly transferring them to purgeable buffer stations upon wafers arriving at a docking port are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.