Package of a chip with beveled edges
US6700178B2 · kind B2 · utility
35Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2001 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Nov 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip with beveled edges suitable for adhering onto a surface of a die pad by an adhesive material. The chip has an active surface and a corresponding back surface, wherein the active surface has beveled edges. The back surface of the chip is adhered onto the surface of the die pad by the adhesive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.