Inventor · New Taipei, TW

Wei-Min Hsiao

21Patents
6h-index
17Co-inventors
66Inventor score

Filing activity: Apr 19, 2001 → Dec 29, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US7829961B2 MEMS microphone package and method thereof Electricity 115 Active
US6700178B2 Package of a chip with beveled edges Electricity 35 Expired
US7808060B2 MEMS microphone module and method thereof Performing Operations; Transporting 34 Active
US7560744B2 Package optical chip with conductive pillars Electricity 24 Active
US7238590B2 Package structure of semiconductor and wafer-level formation thereof Electricity 23 Expired
US7563652B2 Method for encapsulating sensor chips Electricity 9 Active
US8194896B2 Packaging structure and method of a MEMS microphone Electricity 5 Active
US7573124B2 Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same Electricity 5 Active
US10063070B2 Battery active balancing system Emerging Cross-Sectional Technologies 4 Active
US8053367B2 Wafer polishing method Physics 1 Active
US10377262B2 Range extending apparatus for electric vehicle and control method thereof Emerging Cross-Sectional Technologies 1 Active
US10594143B2 Charging method for battery set and battery management system using the same Emerging Cross-Sectional Technologies 1 Active
US8975157B2 Carrier bonding and detaching processes for a semiconductor wafer Electricity 1 Active
US11658370B2 Safety protection device and method for battery test system Emerging Cross-Sectional Technologies 1 Active
US11675018B1 Portable battery detection device Physics 0 Active
US8865520B2 Carrier bonding and detaching processes for a semiconductor wafer Emerging Cross-Sectional Technologies 0 Active
US10536020B2 Charging control apparatus, charging control method and computer readable medium thereof Physics 0 Active
US11169212B2 External battery short-circuit testing device Emerging Cross-Sectional Technologies 0 Active
US10404527B2 Link reestablishment method and electrical system using the same Electricity 0 Active
US9929078B2 Semiconductor package structure and method for manufacturing the same Electricity 0 Active
US7674688B2 Sawing method for a semiconductor element with a microelectromechanical system Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.