Method for making a build-up package of a semiconductor
US6701614B2 · kind B2 · utility
52Cited by
12References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 15, 2002 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Feb 15, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making a build-up package of a semiconductor die and a structure formed from the same. A copper foil with conductive columns is bonded to an encapsulated die by thermal compression, between thereof there is a pre-curing dielectric film sandwiched. The dielectric film is cured to form a dielectric layer of a die build-up package and the copper foil on the dielectric layer is etched to form the conductive traces. At least one conductive column in one of the dielectric layers is vertically corresponding to one of conductive column in the adjacent dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.