Leadless socket for decapped semiconductor device
US6702589B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2002 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Aug 16, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/912
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus for mounting a semiconductor device to a circuit board for testing is disclosed. The semiconductor device includes semiconductor circuitry and leads to connect the semiconductor circuitry to the circuit board. Additionally, the semiconductor device is decapped so that at least a portion of the semiconductor circuitry is exposed. The apparatus includes a frame and a fastener. The frame is adapted to mate with the semiconductor device, and forms an opening for accessing the semiconductor circuitry and an edge surface for receiving the semiconductor device. The fastener is connected with the frame for removably connecting the frame to the circuit board. By using a frame instead of a socket, the distance to the semiconductor device once the device is mounted to the circuit board, and particularly the top side of the semiconductor device, can be reduced so that the device may be tested using a probe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.