Rapid thermal processing system for integrated circuits
US6707011B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2002 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Oct 16, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/0047
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a rapid thermal processing system an array of heat lamps generate radiant heat for heating the surfaces of a semiconductor substrate, such as a semiconductor wafer, to a selected temperature or set of temperatures while held within an enclosed chamber. The heat lamps are surrounded by one or more optically transparent enclosures that isolate the heat lamps from the chamber environment and the wafer or wafers therein. The optically transparent enclosures include associated reflectors to direct a higher proportion of emitted radiant heat energy from the lamps toward the semiconductor wafer(s). The lamps with such enclosures are mounted for rotation so that the reflectors may alternately shield all or a portion of emitted lamp radiation from the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.