Needle load measuring method, needle load setting method and needle load detecting mechanism
US6707310B2 · kind B2 · utility
5Cited by
10References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 10, 2003 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Feb 10, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is a method of inspecting the electrical characteristics of a to-be-inspected object formed on a wafer under the state that the wafer chuck having the wafer placed thereon is overdriven by a lift mechanism, wherein measured is the sinking amount of the wafer chuck caused by the needle load applied from a plurality of probes of a probe card to the wafer chuck. Also disclosed are a needle load measuring method for measuring the applied needle load from the sinking amount, a needle load setting method, and a needle load detecting mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.