Method and apparatus for wafer-to-wafer control with partial measurement data
US6708129B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2001 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Oct 2, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and an apparatus for performing a process control using partial measurement data. A process operation is performed on a semiconductor wafer. Inline metrology data related to the process of the semiconductor wafer is acquired. A partial measurement data acquisition process is performed based upon the inline metrology data, the partial measurement data acquisition process comprising determining a time period for acquiring the inline metrology data, determining a number of wafers to be sampled based upon the time period, and determining a number of wafer sites for data acquisition. At least one of a feedback adjustment on a second semiconductor wafer and a feed-forward adjustment relating to a subsequent processing of the first semiconductor wafer based upon the partial measurement data acquisition process is performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.