Robot blade for semiconductor processing equipment
US6709218B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1999 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Aug 27, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
The present invention generally provides a robot blade which provides a plurality of semi-conductive or conductive contacts disposed at least partially on the surface of the blade to support a substrate above the blade. The contacts are preferably located inwardly from the edge of the blade and toward the center of the blade to provide a collection area on the blade to capture any particles which may form. The blade is preferably made of a semi-conductive material, such as alumina or other semi-conductive material, to provide an electrical flow path through the contact(s) to discharge any electrical charge which may build up on the substrate during processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.