Method for determining concentrations of additives in acid copper electrochemical deposition baths
US6709568B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2002 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Jun 13, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/42
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a method for determining concentration of brightener and leveler contained in an aqueous acid metal electroplating solution, by firstly determining the concentration of the brightener at a first set of measurement conditions, and secondly determining the concentration of the leveler at a second set of measurement conditions, provided that the first set of measurement conditions differ from the second set of measurement conditions on the rotation speed of a rotating disc electrode used for measuring plating potential of said aqueous acid metal electroplating solution, and optionally, the electroplating duration at which the plating potential of said aqueous acid metal electroplating solution is measured, provided that the first rotation speed is lower than the second rotation speed, and that the first electroplating duration is shorter than the second electroplating duration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.