Thermally enhanced interposer and method
US6712621B2 · kind B2 · utility
88Cited by
15References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Jan 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4641
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a heat spreading connector suitable for use with electronic components including those using land grid arrays and pin grid arrays and a method for its use. The connector of the present invention includes at least one dielectric layer and at least one thermally conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.