Clean aluminum alloy for semiconductor processing equipment
US6713188B2 · kind B2 · utility
15Cited by
5References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2003 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Jan 27, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/263
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
We have discovered that the formation of particulate inclusions at the surface and the interior of an aluminum alloy article interferes with the performance of the article when a surface of the article is protected by an anodized coating. We have also discovered that the formation of such particulate inclusions can be controlled to a large extent by controlling the concentration of particular impurities present in the alloy used to fabricate the aluminum alloy article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.