Method and device for thermally connecting the contact surfaces of two substrates
US6713714B1 · kind B1 · utility
Assignees
Inventor
Key dates
| Filing date | Jul 17, 2001 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Jul 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and a device for thermally connecting the terminal areas (26, 27) of a contact substrate (11) to the terminal areas (28, 29) of a carrier substrate (12), where the substrates (11, 12) are, in order to produce the connection, arranged in a connecting position such that the terminal areas (26, 28; 27, 29) are situated opposite one another in the plane of the connection, where the contact substrate (11) is heated to the connecting temperature from its rear side that is situated opposite the terminal areas (26, 27) in order to reach the required connecting temperature in the plane of the connection, and where the contact substrate (11) is heated by subjecting the substrate to laser energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.