Method and apparatus for controlling film profiles on topographic features
US6716322B1 · kind B1 · utility
10Cited by
6References
51Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2002 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Apr 19, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/044
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A deposition system includes a substrate holder supporting a substrate defining at least one topographical feature. In addition, the system includes a deposition plume that is directed toward the substrate. A first profiler mask is positioned between the deposition plume and the substrate, and is shaped so as to reduce inboard/outboard asymmetry in a deposition profile associated with the feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.