Method and apparatus for performing overlay measurements using scatterometry
US6716646B1 · kind B1 · utility
51Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2001 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Jul 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides for a method and an apparatus for overlay measurements using optical techniques. At least one semiconductor device is processed. Metrology data from the processed semiconductor device is acquired. A scatterometry overlay analysis based upon the metrology data is performed. At least one modified manufacturing parameter is calculated based upon the scatterometry overlay analysis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.