Contact planarization materials that generate no volatile byproducts or residue during curing
US6716767B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2002 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Dec 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed towards planarization materials that produce little or no volatile byproducts during the hardening process when used in contact planarization processes. The materials can be hardened by photo-irradiation or by heat during the planarization process, and they include one or more types of monomers, oligomers, or mixtures thereof, an optional cross-linker, and an optional organic reactive solvents. The solvent, if used, is chemically reacted with the monomers or oligomers and thus becomes part of the polymer matrix during the curing process. These materials can be used for damascene, dual damascene, bi-layer, and multi-layer applications, microelectromechanical system (MEMS), packaging, optical devices, photonics, optoelectronics, microelectronics, and sensor devices fabrication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.