Lead-frame method and circuit module assembly including edge stiffener
US6717822B1 · kind B1 · utility
9Cited by
14References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2002 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Sep 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/202
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An edge stiffener added to a lead-frame based circuit module provides protection of the peripheral flange of the circuit module during handling and manufacturing processes. The edge stiffener may be coupled to leads of the lead-frame for providing electrical contacts at the periphery of the circuit module or may be form widened portions of a tie bar that is connected to the lead frame by leads extending through gaps between the ends of the edge stiffener portions. Singulation of the circuit module will result in edge stiffener portions that are not coupled to the lead frame, but are secured within the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.