Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques
US6721045B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 6, 2000 |
| Grant date | Apr 13, 2004 |
| Priority date | — |
| Expiry date | Jan 18, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/956
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. More specifically, a method and apparatus providing embedded substrate monitoring through consolidation of multiple process inspection techniques in semiconductor processing equipment is disclosed. In one aspect, an optical inspection system comprising a light source and an optical receiving device, such as a CCD camera, is used to illuminate and inspect a substrate for various optical signatures. A plurality of optical inspection systems are strategically located in a cluster tool environment in order to collect optical information during processing steps. Taken together, the plurality of optical inspection systems operate as a monitoring system to determine substrate process conditions and routing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.