Method of manufacturing a semiconductor device using a mold
US6723583B2 · kind B2 · utility
13Cited by
12References
22Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 4, 2003 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Jun 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.