Power semiconductor die attach process using conductive adhesive film
US6723620B1 · kind B1 · utility
4Cited by
25References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 22, 2000 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Nov 22, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A large area adhesive film is attached to a semiconductor wafer containing a large number of identical structures. The film and wafer are then simultaneously singulated and the individual die with film thereon are then placed atop a lead frame and the film is completely cured to adhere the semiconductor die to the lead frame. Plural die can be mounted side-by-side on a common substrate, or one die can be mounted atop a second die which is on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.