Processing platform with integrated particle removal system

US6725564B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Reginald Hunter · Round Rock, US
• Joel Brad Bailey · Austin, US

Key dates

• Filing date: Dec 6, 2001
• Grant date: Apr 27, 2004
• Expiry date: Apr 29, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S134/902
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the invention generally provide a multistage semiconductor processing tool, wherein the processing tool includes a first transfer chamber having a first substrate transfer robot positioned therein and at least one load lock chamber in communication with the first transfer chamber. The at least one load lock is generally configured to communicate substrates into and out of the first transfer chamber. Further, the processing tool includes at least one substrate cleaning chamber positioned in communication with the first transfer chamber. The at least one substrate cleaning chamber generally includes a substrate support member, a broadband actuation device in communication with the substrate support member, and a particle removal device configured to sweep away dislodged particles from an area proximate the substrate surface. The processing tool further includes a second transfer chamber having a second substrate transfer robot positioned therein, the second transfer chamber being in selective communication with the first transfer chamber, and at least one substrate processing chamber in communication with the second transfer chamber.