Method for fabricating a dual-diameter electrical conductor
US6727174B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2000 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Sep 4, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a multi-diameter electrical conductor for use as an embedded plug in a microelectronic device. The multi-diameter electrical conductor consists of a body portion which has a first diameter, and at least one neck portion in contact with the body portion that has at least a second diameter smaller than the first diameter. In a preferred embodiment, the multi-diameter conductor is a dual-diameter conductor providing electrical communication between an electrode and an active circuit element in a semiconductor structure and comprising a lower body portion and an upper neck portion. The conductive materials used in forming the body portion and the neck portion of the contact plug can be selected from doped polysilicon, refractory metals, metal silicides, low resistivity metals, noble metals and their alloys, adhesion layers, metallic diffusion barrier layers, and oxide and nitride diffusion barrier materials. In a preferred embodiment, the body portion is formed of a first conductive material while the neck portion is formed of a second conductive material. In an alternate embodiment, the body portion and the neck portion are formed of the same conductive…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.