David E. Kotecki
60Patents
22h-index
76Co-inventors
87Inventor score
Filing activity: Apr 29, 1991 → Jun 18, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5789320A | Plating of noble metal electrodes for DRAM and FRAM | Electricity | 244 | Expired |
| US5313094A | Thermal dissipation of integrated circuits using diamond paths | Electricity | 102 | Expired |
| US6178082A | High temperature, conductive thin film diffusion barrier for ceramic/metal systems | Electricity | 66 | Expired |
| US6025226A | Method of forming a capacitor and a capacitor formed using the method | Electricity | 63 | Expired |
| US6136664A | Filling of high aspect ratio trench isolation | Electricity | 62 | Expired |
| US5548470A | Characterization, modeling, and design of an electrostatic chuck with improved wafer temperature uniformity | Electricity | 62 | Expired |
| US5879985A | Crown capacitor using a tapered etch of a damascene lower electrode | Electricity | 55 | Expired |
| US6165864A | Tapered electrode for stacked capacitors | Electricity | 51 | Expired |
| US5825609A | Compound electrode stack capacitor | Electricity | 44 | Expired |
| US5633781A | Isolated sidewall capacitor having a compound plate electrode | Electricity | 39 | Expired |
| US5636320A | Sealed chamber with heating lamps provided within transparent tubes | Mechanical Engineering; Lighting; Heating | 39 | Expired |
| US6261967A | Easy to remove hard mask layer for semiconductor device fabrication | Electricity | 38 | Expired |
| US5585998A | Isolated sidewall capacitor with dual dielectric | Emerging Cross-Sectional Technologies | 36 | Expired |
| US5268069A | Safe method for etching silicon dioxide | Electricity | 33 | Expired |
| US5192708A | Sub-layer contact technique using in situ doped amorphous silicon and solid phase recrystallization | Emerging Cross-Sectional Technologies | 33 | Expired |
| US6166423A | Integrated circuit having a via and a capacitor | Electricity | 31 | Expired |
| US5675471A | Characterization, modeling, and design of an electrostatic chuck with improved wafer temperature uniformity | Electricity | 30 | Expired |
| US5266504A | Low temperature emitter process for high performance bipolar devices | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5998250A | Compound electrode stack capacitor | Electricity | 29 | Expired |
| US5741363A | Interiorly partitioned vapor injector for delivery of source reagent vapor mixtures for chemical vapor deposition | Chemistry; Metallurgy | 28 | Expired |
| US6727174B1 | Method for fabricating a dual-diameter electrical conductor | Electricity | 24 | Expired |
| US5701647A | Method for making an isolated sidewall capacitor having a compound plate electrode | Electricity | 23 | Expired |
| US5796573A | Overhanging separator for self-defining stacked capacitor | Electricity | 22 | Expired |
| US6124199A | Method for simultaneously forming a storage-capacitor electrode and interconnect | Electricity | 22 | Expired |
| US5973351A | Semiconductor device with high dielectric constant insulator material | Electricity | 21 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.