Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process
US6730532B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2002 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Jun 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/80
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and system for universal packaging in conjunction with an automated in-line back-end IC manufacturing process. In one method embodiment, the present invention processes a die-strip through a number of integrated in-line processes that function independently of the die size of the die-strip. A control computer maintains a die-strip map database recording the die size of the die-strip. In-line molding and solder ball attachment processes are then performed and function independently of the die size of the die-strip. Processes that are independent of die size provide a universal packaging manufacturing solution. The present invention then accesses the database to determine the die size for cutting the die-strip based on specifications maintained by the electronic die-strip map database. Sorting, testing and finish assembly processes are then performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.