Method for forming an image sensor package with vision die in lens housing
US6734419B1 · kind B1 · utility
98Cited by
20References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2001 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | Jun 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming an image sensor assembly includes forming a lead frame or Land Grid Array (LGA) integrally into a molded image sensor die package so that the lead frame or LGA is fully supported and structurally fortified by the molded image sensor die package. An image sensor die is then attached to the thus supported lead frame or LGA using a standard flip-chip connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.