Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing
US6736699B2 · kind B2 · utility
2Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2001 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Aug 3, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/908
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An electrolytic polishing apparatus for electrolytic-polishing a conductive film subject to formed on a substrate including a resistance measuring unit for measuring the resistance of the film. The electrolytic polishing apparatus may also include a termination point detecting portion for detecting a termination point of polishing by reading a variation of the resistance value measured by the resistance measuring unit, or a polishing control portion for terminating electrolytic polishing on the basis of the termination point of polishing detected by the termination point detecting portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.