Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same
US6737298B2 · kind B2 · utility
24Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2002 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Mar 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A new method and assembly are provided for anchoring the heat spreader of a PBGA package to the substrate thereof. Anchor features are made part of the PBGA package. These anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.