Carrier head with a vibration reduction feature for a chemical mechanical polishing system
US6739958B2 · kind B2 · utility
7Cited by
48References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2002 |
| Grant date | May 25, 2004 |
| Priority date | — |
| Expiry date | Jun 7, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present invention are directed to a carrier head for positioning a substrate on a polishing surface. The carrier head includes a housing connectable to a drive shaft to rotate therewith; a base; a detachable plate removably mounted on top of the housing; a gimbal mechanism connecting the housing to the base to permit the base to move with respect to the housing such that the base remains substantially parallel to the polishing surface; and a flexible membrane defining a mounting surface for the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.