Patent · US Expired

EMI shielding for semiconductor chip carriers

US6740959B2 · kind B2 · utility

65Cited by
33References
28Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 1, 2001
Grant dateMay 25, 2004
Priority date—
Expiry dateAug 1, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3025
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.