Semiconductor die package including cup-shaped leadframe
US6744124B1 · kind B1 · utility
40Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 1999 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Dec 10, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.