Flip chip integrated circuit packages accommodating exposed chip capacitors while providing structural rigidity
US6744131B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2003 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Apr 22, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC package provides structural rigidity to a flexible substrate, but still allows access to mounted capacitors after package assembly. In a flip chip package, the IC die is mounted face down on a flexible laminate substrate. A metal lid is mounted above and in contact with the die. The metal lid includes openings over portions of an outer region of the substrate to accommodate the capacitors. However, portions of the metal lid extend to the corners of the substrate to provide structural rigidity to the flexible substrate. Some embodiments are directed to packages configured as described above, but in which an IC die has yet to be mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.