Measuring apparatus
US6746319B2 · kind B2 · utility
11Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2002 |
| Grant date | Jun 8, 2004 |
| Priority date | — |
| Expiry date | Aug 7, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0666
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A measuring apparatus includes a heating unit for applying heat to a first point within a workpiece or on a surface of a workpiece and propagating the heat to a second point within the workpiece or on the surface of the workpiece. The measuring apparatus further includes a measuring unit for measuring a displacement of the surface of the workpiece at the second point to which the heat has been propagated, and an analyzing unit for analyzing a structure of the workpiece based on the displacement measured by the measuring unit in consideration of a distance between the first point and the second point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.