Image sensor having shortened wires
US6747261B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2003 |
| Grant date | Jun 8, 2004 |
| Priority date | — |
| Expiry date | Jan 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16245
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An image sensor having shortened wires. The image sensor includes a substrate composed of metal sheets arranged in a matrix, a photosensitive chip, bonding pads on the chip, a frame layer, wires and a transparent layer placed on the frame layer. Each metal sheet has a first board and a second board. A chamber is defined under the substrate to accommodate the chip. Each pad is arranged between first boards. The frame layer is formed on a periphery and the bottom surface to encapsulate the chip. The bottom faces of the second boards are electrically connected to a printed circuit board. Each wire has a first terminal and a second terminal. The first terminals are electrically connected to the pads, and the second terminals are electrically connected to the first boards, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.