Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same
US6747472B2 · kind B2 · utility
4Cited by
6References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2002 |
| Grant date | Jun 8, 2004 |
| Priority date | — |
| Expiry date | Jul 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/325
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for testing a collection of device chips by temporarily attaching them to a carrier having a plurality of receptacles with microdendritic features; the receptacles matching with and pushed in contact with a matching set of contact pads on the device chips; said carrier additionally having test pads connected to the receptacles through interconnect wiring. The system allows connecting the chips together and testing the collection as a whole by probing the test pads on the carrier. Burn-in of the collection of chips can also be performed on the temporary carrier, which is reusable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.