Angular spin, rinse, and dry module and methods for making and implementing the same
US6748961B2 · kind B2 · utility
3Cited by
11References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2001 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | Mar 30, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer preparation module is provided. The wafer preparation module includes an enclosure, which contains wafer engaging rollers. The wafer engaging rollers are oriented at an angle and are designed to spin a wafer at an angle during preparation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.