Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards
US6749345B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2002 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | Jun 18, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4292
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Electro-optical packages that embed the electronics of the packages directly to the optical cabling, provide short electrical connection paths for high performance, and that provide a robust interconnects. A first electro-optical package includes an integrated circuit and a connector sleeve configured to receive a plug-in optical assembly from the underside of the PC board. The plug-in optical assembly includes a backing piece and an opto-electric device mounted onto the backing piece. An electrical connection is provided between the opto-electric device and a contact location on the backing piece and a contact is provided between the contact location on the backing piece and the integrated circuit. With a second electro-optical package, an integrated circuit having an active surface facing in a first direction and an opto-electric device having contact points facing a second direction are provided. The integrated circuit and the opto-electric are positioned with respect to one another such that a direct electrical connection can be formed between the active surface of the integrated circuit and the contact points of the opto-electrical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.