Stephen Gee
7Patents
4h-index
11Co-inventors
46Inventor score
Filing activity: Dec 14, 2000 → Nov 4, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6462426B1 | Barrier pad for wafer level chip scale packages | Electricity | 52 | Expired |
| US7098540B1 | Electrical interconnect with minimal parasitic capacitance | Electricity | 44 | Expired |
| US6802654B1 | Electrical connector for opto-electronic modules | Electricity | 20 | Expired |
| US6749345B1 | Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards | Physics | 13 | Expired |
| US7023705B2 | Ceramic optical sub-assembly for optoelectronic modules | Electricity | 4 | Expired |
| US7812462B2 | Conductive paths for transmitting an electrical signal through an electrical connector | Electricity | 2 | Active |
| US7269027B2 | Ceramic optical sub-assembly for optoelectronic modules | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.