Semiconductor device and process for manufacturing the same
US6750080B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 25, 2003 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | Feb 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Two semiconductor chips are bonded to each other with the rear surfaces of the respective semiconductor chips faced to each other, so that two longer sides of the semiconductor chips may confront the side of leads, and supporting leads are bonded and fixed onto the circuit forming surface of one of the semiconductor chips. The semiconductor chips are further bonded to each other in a state where the positions of the respective semiconductor chips are staggered relative to each other so that electrodes of one semiconductor chip may lie outside the other longer side of the other semiconductor chip, and that electrodes of the second semiconductor chip may lie outside the other longer side of the first semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.